Welcome to ConTEL 2021, the 16th International Conference on Telecommunications. The conference will be held from June 30th to July 2nd, 2021, in hybrid format, including a “live” event (if possible due to the COVID-19 situation in Croatia) and virtual participation a norm. More details will be published in the conference program. If possible, the […]

The notifications of acceptance/rejection will be sent out by May 17, 2021. The final, camera ready papers should be submitted by May 26, 2021. All of the important dates are stated in the Important dates section.

We kindly remind you that the review manuscript for ConTEL 2021 Special Sessions should be submitted by the end of April 15, 2021. You can submit your paper to the following Special sessions using the EDAS platform: New Educational Paradigms in Telecommunications Security and Privacy in Modern Telecommunication Networks Special Session of the CEEPUS Network […]

MDPI Telecom, an open access journal, is sponsoring the Best Paper Award at ConTEL 2021, and the winner will receive a 100% discount on the publication of the extended version of the paper in MDPI Telecom Journal along with an award bonus of 300 CHF.

ConTEL 2021 will be a hybrid conference allowing for physical and virtual paper presentations. Details regarding virtual paper presentations will be available later (most likely there will be prerecorded video with lie Q&A). Workshops will also be hybrid, allowing for physical and virtual attendance.

The conference will have 3 keynote talks – find more details here.

The deadline for submissions is extended to April 7, 2021 (hard deadline). Make sure to upload title and abstract until April 2, 2021!

New special session is announced, entitled “Special Session of the CEEPUS Network CIII-BG-1103 ”. You can read more here.

New special session is announced, entitled “Security and Privacy in Modern Telecommunication Networks ”. You can read more here.

New special session is announced, entitled “New Educational Paradigms in Telecommunications ”. You can read more here.